Hasan, Md. and Islam, Tania and Rahman, Khandkar and Ratul, Sourav B and Islam, Md. and Sharmin, Arifa and Islam, Md. (2015) Hybrid Particleboard from Wood and Non-Wood Species: Physical and Mechanical Properties as a Function of Particle Mixing Ratio. Advances in Research, 3 (5). pp. 502-511. ISSN 23480394
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Abstract
Aims: In this paper three-layer hybrid particleboard was fabricated from kadam (Anthocephalus chinensis) and kenaf (Hibiscus cannabinus L.) as a function of particle mixing ratio based on oven dried weight.
Experimental: Three types of three-layer hybrid particleboards i.e., HBPB-A (Fine: kenaf; coarse: kadam), HBPB-B (Fine: kadam; coarse: kenaf), HBPB-C (kadam and kenaf mixed); and two types of control particleboard i.e., CPB-D (kadam) and CPB-E (kenaf) were fabricated with 10% urea formaldehyde resin. The effects of particle ratio on the physical and mechanical properties of new hybrid particleboards were investigated according to the procedure of ASTM D-1037 standard.
Results: It was found that the particle ratio within and/or between layers showed significant effects on the physical and mechanical properties of the hybrid particleboards. It was also observed that hybrid particleboard HBPB-C with the ratio of kadam: Kenaf(50:50) exhibited the highest mechanical properties i.e. modulus of elasticity and modulus of rupture and physical properties i.e. density, moisture content, water absorption and thickness swelling, compared to HBPB-A (kenaf: kadam-40:60) and HBPB-B (kadam: kenaf-40:60) hybrid particleboards. HBPB-C also showed higher physical and mechanical properties compared to the CPB-E, however, it was lower than the CPB-D.
Conclusion: The results confirmed that HBPB-C and HBPB-B particleboard met the minimum ANSI A208.1 requirements for physical and mechanical properties of M-3 grade particleboard. Thus, such kind of hybrid particleboard is technically feasible.
Item Type: | Article |
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Subjects: | Universal Eprints > Multidisciplinary |
Depositing User: | Managing Editor |
Date Deposited: | 09 Jun 2023 04:05 |
Last Modified: | 23 Jan 2024 04:07 |
URI: | http://journal.article2publish.com/id/eprint/2104 |